• DocumentCode
    2247234
  • Title

    Developing phase-shifting micro moire interferometry using phase shifter with rough resolution and by shifting specimen grating

  • Author

    Yang, Se Young ; Lee, Soon Bok

  • Author_Institution
    Dept. of Mech. Eng., Korea Adv. Energy Res. Inst., Daejeon, South Korea
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    399
  • Lastpage
    403
  • Abstract
    In this research, phase shifting method is used to modify PEMI (portable engineering moire interferometer) into micro moire interferometer which can measure displacement field with highly improved sensitivity. Apart from existing micro moire technique, a low cost and less precise translation stage with rough resolution (10 μm resolution) is adapted for the phase shifter. Moreover, specimen grating instead of reference grating is phase shifted and again the cost is outstandingly reduced. Least square algorithm and other image processing schemes, such as FFT filtering and fringe enhancement technique, are applied to minimize the errors induced by lowering the cost. To verify the newly constructed micro moire technique, displacement fields of flip chip package with ACA interconnection and wafer level chip size package were measured. In case of flip chip package, microscopic local displacement fields such as ACA layer and underfilled area were obtained with increased sensitivity. For chip size package, displacement field of a solder ball with 400 μm diameter was acquired with predominantly elevated sensitivity of 26 nm per fringe
  • Keywords
    chip scale packaging; fast Fourier transforms; flip-chip devices; least squares approximations; light interferometry; soldering; 400 micron; FFT filtering; PEMI; displacement field; flip chip package; fringe enhancement technique; image processing schemes; least square algorithm; phase-shifting micro moire interferometry; portable engineering moire interferometer; resolution; sensitivity; solder ball; specimen grating; translation stage; underfilled area; wafer level chip size package; Costs; Displacement measurement; Flip chip; Gratings; Least squares methods; Packaging; Phase measurement; Phase shifters; Phase shifting interferometry; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
  • Conference_Location
    Jeju Island
  • Print_ISBN
    0-7803-7157-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2001.984017
  • Filename
    984017