DocumentCode
2249450
Title
Fabrication of fiber-optic EFPI with double-layer SU-8 diaphragm
Author
Ding, Ding ; Chen, Na ; Guo, Qiang ; Chen, Zhenyi ; Liu, Shupeng ; Pang, Fufei ; Wang, Tingyun
Author_Institution
Key Lab. of Specialty Fiber Opt. & Opt. Access Networks, Shanghai Univ., Shanghai, China
fYear
2011
fDate
13-16 Nov. 2011
Firstpage
1
Lastpage
6
Abstract
In this paper, we fabricated fiber-optic extrinsic Fabry-Perot interferometric (EFPI) sensors with photolithography. The sensor has double-layer SU-8 diaphragm: one is the pressure transduction layer; the other is cavity control layer. Since SU-8 material has a low Young´s modulus, high pressure sensitivity can be achieved with SU-8 diaphragm. The EFPI were formed by a single mode fiber and a double-layer SU-8 diaphragm. To improve the fringe contrast, gold mirrors with a reflectivity of 50% were evaporated onto the end face of the single mode fiber and the inner face of the SU-8 diaphragm respectively. Experiments were done to estimate the performance of the sensor for static pressure measurement. The results show that an expected cavity length of the sensor was obtained and the EFPI sensor has a good linearity from 100 to 2500 Pa with 100 Pa resolution and a sensitivity of 154.8 nm/kPa.
Keywords
Fabry-Perot interferometers; Young´s modulus; fibre optic sensors; gold; mirrors; optical fibre fabrication; photolithography; pressure measurement; pressure transducers; Au; EFPI sensors; Young´s modulus; cavity control layer; double-layer SU-8 diaphragm; extrinsic Fabry-Perot interferometry; fiber-optic EFPI; fiber-optic sensors; fringe contrast; gold mirrors; photolithography; pressure transduction layer; single mode fiber; static pressure measurement; Educational institutions; Optical device fabrication; Optical fiber sensors; Optical fibers; Optical variables measurement; EFPI; SU-8; fiber optic sensor; photolithography;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications and Photonics Conference and Exhibition, 2011. ACP. Asia
Conference_Location
Shanghai
ISSN
2162-108X
Print_ISBN
978-0-8194-8961-6
Type
conf
DOI
10.1117/12.905510
Filename
6210917
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