DocumentCode
2249723
Title
Rigorous simulation of line-defects in EUV masks
Author
Schiavone, P. ; Payerne, R.
Author_Institution
Lab. des Technol. de la Microelectronique, CNRS, Grenoble, France
fYear
2001
fDate
Oct. 31 2001-Nov. 2 2001
Firstpage
126
Abstract
Summary form only given. We use rigorous electromagnetic simulation to investigate the behaviour of EUV defective masks. Using the Fourier modal method, the geometry of the structure as well as the polarisation state can be handled (in 2D in the current version of the code). The speed of our simulation allows us to make an evaluation of the problem of the defects without making too restrictive hypotheses (for example, on the number of layers or on the layer geometry). A very simple analytical model has been developed in order to generate the input geometry for the simulations. The deposition conditions can be mimicked by changing an empirical parameter representing the planarisation properties of the process.
Keywords
Fourier analysis; masks; semiconductor process modelling; ultraviolet lithography; EUV masks; Fourier modal method; absorber feature; analytical model; deposition conditions; layer geometry; line defects; multilayer mirror; planarisation properties; polarisation state; rigorous electromagnetic simulation; Analytical models; Circuit simulation; Electronic mail; Integrated circuit technology; Nonhomogeneous media; Planarization; Solid modeling; Ultraviolet sources;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location
Shimane, Japan
Print_ISBN
4-89114-017-8
Type
conf
DOI
10.1109/IMNC.2001.984121
Filename
984121
Link To Document