PATCHWORK smart power thick-film hybrids for automotive under hood applications

Author

Wilczek, Peter K.

Author_Institution

TT electronics - AB Mikroelektron., Salzburg, Austria

fYear

2002

fDate

2002

Firstpage

35

Lastpage

40

Abstract

PATCHWORK provides a high degree of integration combining logic and power on one ceramic substrate to respond to customer-specific circuits with acceptable engineering costs and short periods of development. The hybrids are reliable and high-temperature resistant and can be manufactured at a fair market price. The introduction of PATCHWORK combines Ag/Pd/Pt, copper and gold conductors, high temperature solder, window framing design and efficient thermal properties. With these advances in thick film technology many high volume opportunities are open in automotive applications.

Keywords

automotive electronics; ceramic packaging; high-temperature electronics; hybrid integrated circuits; integrated circuit economics; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; power integrated circuits; soldering; thermal management (packaging); thick film circuits; 150 degC; Ag/Pd/P conductors; AgPdPt-Cu-Au; Al; PATCHWORK smart power thick-film hybrids; automotive applications; automotive under-hood applications; ceramic substrates; circuit development time; circuit engineering costs; copper conductors; customer-specific circuits; gold conductors; high temperature solder; high volume thick film technology; high-temperature resistance; hybrid reliability; logic/power integration; manufacturing costs; thermal efficiency; thermal properties; window framing design; wire bonding; Automotive engineering; Ceramics; Copper; Costs; Integrated circuit reliability; Logic circuits; Manufacturing; Power engineering and energy; Reliability engineering; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International

Print_ISBN

0-7803-7301-4

Type

conf

DOI

10.1109/IEMT.2002.1032719

Filename

1032719