• DocumentCode
    2253639
  • Title

    Efficient job-release plan development for semiconductor assembly and testing in GA

  • Author

    Wang, Kung-jeng ; Chiu, Chun-chih ; Gong, Dah-chuan

  • Author_Institution
    Dept. of Ind. Manage., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
  • Volume
    3
  • fYear
    2010
  • fDate
    11-14 July 2010
  • Firstpage
    1205
  • Lastpage
    1210
  • Abstract
    Taiwan´s semiconductor integrated circuit (IC) industry plays an important role in the world and has maintained a major market share, especially, in the business of IC´s packaging and testing. In the past, many studies have discussed job-release models for upstream IC manufacturing, but few emphasize on the IC turnkey factory, which including IC assembly and testing operations. In this paper, a job-release strategy for an IC turnkey factory with known assembly cycle time will be proposed. Concerning objectives under limited-capacity resources are (1) increasing the overall equipment efficiency (OEE) of IC test equipments, (2) reducing the fabrication cycle time, and (3) increasing the on-time delivery (OTD) rate. A genetic algorithm (GA) is applied to obtain an efficient job-release plan based on the data of an IC turnkey factory in Taiwan.
  • Keywords
    assembly planning; genetic algorithms; integrated circuit manufacture; integrated circuit packaging; integrated circuit testing; IC packaging; IC testing; IC turnkey factory; assembly cycle time; fabrication cycle time; genetic algorithm; job-release plan development; limited-capacity resources; on-time delivery rate; overall equipment efficiency; semiconductor assembly; semiconductor integrated circuit industry; upstream IC manufacturing; Assembly; Integrated circuits; Materials; Planning; Production facilities; Testing; Genetic algorithm; IC testing; IC turnkey factory; Job-release;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Machine Learning and Cybernetics (ICMLC), 2010 International Conference on
  • Conference_Location
    Qingdao
  • Print_ISBN
    978-1-4244-6526-2
  • Type

    conf

  • DOI
    10.1109/ICMLC.2010.5580909
  • Filename
    5580909