• DocumentCode
    2253914
  • Title

    Reliability of CSP/lead free solder joints with different surface finishes and reflow profiles

  • Author

    Me, D. ; Geiger, David ; Arra, Minna ; Shangguan, Dongkai ; Phan, Hoang

  • Author_Institution
    FLEXTRONICS
  • fYear
    2002
  • fDate
    17-18 July 2002
  • Firstpage
    323
  • Lastpage
    328
  • Keywords
    Assembly; Chip scale packaging; Environmentally friendly manufacturing techniques; Lead; Soldering; Surface finishing; Surface-mount technology; Temperature distribution; Testing; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    0-7803-7301-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2002.1032773
  • Filename
    1032773
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2253914