• DocumentCode
    2254981
  • Title

    Equivalent circuit modeling of multilayered power/ground planes for fast transient simulation

  • Author

    Watanabe, Takayuki ; Asai, Hideki

  • Author_Institution
    Sch. of Adm. & Inf., Univ. of Shizuoka, Shizuoka, Japan
  • fYear
    2010
  • fDate
    8-12 March 2010
  • Firstpage
    1153
  • Lastpage
    1158
  • Abstract
    This paper presents a modeling method for power distribution networks (PDNs) consisting of multilayered power/ground planes of the PCB/Package. Using our proposed method, multiple stacked power/ground plane pairs having holes and apertures can be modeled as an equivalent circuit. The structure of this equivalent circuit is suitable for the Latency Insertion Method (LIM), which is one of the fast transient simulation methods based on the ??leapfrog?? algorithm. Numerical results show that the leapfrog algorithm enables a speed-up of 105 and 486 times compared to the linear circuit simulator based on the sparse LU-decomposition and HSPICE, respectively, with the same level of accuracy.
  • Keywords
    SPICE; circuit simulation; distribution networks; equivalent circuits; integrated circuit modelling; transient analysis; HSPICE; equivalent circuit modeling; fast transient simulation; latency insertion method; leapfrog algorithm; linear circuit simulator; multilayered power/ground planes; power distribution network; sparse LU-decomposition; stacked power/ground plane; Apertures; Circuit simulation; Computational modeling; Delay; Equivalent circuits; Packaging; Power systems; RLC circuits; SPICE; Voltage; component; leapfrog algorithm; power distribution network; power integrity; spice;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
  • Conference_Location
    Dresden
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-4244-7054-9
  • Type

    conf

  • DOI
    10.1109/DATE.2010.5456982
  • Filename
    5456982