A novel 2-sided multi-chip-module used to create a 50,000 gate programmable logic device

Author

Terrill, Richard

Author_Institution

Altera Corp., San Jose, CA, USA

fYear

1995

fDate

31 Jan-2 Feb 1995

Firstpage

56

Lastpage

60

Abstract

A 32-layer ceramic multi-chip-module was created to support a 50,000-gate programmable logic device. The high gate-count was achieved by combining four 12,500-gate PLDs and one programmable interconnect on both sides of a 32-layer ceramic substrate. A known-good-die process has been developed for one of the active components by using the module itself as a test bed. In addition, an assembly process has been developed which maximizes rework yield. Made possible with MCM technology, this high-density device is intended for gate array prototyping

Keywords

ceramics; microassembling; multichip modules; programmable logic devices; 2-sided multi-chip module; 32-layer ceramic substrate; PLD; assembly process; ceramic MCM; gate array prototyping; high-density device; known-good-die process; programmable interconnect; programmable logic device; Ceramics; Fabrication; Hardware; Integrated circuit interconnections; Programmable logic arrays; Programmable logic devices; Prototypes; Silicon; Software prototyping; Virtual prototyping;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-6970-5

Type

conf

DOI

10.1109/MCMC.1995.512004

Filename

512004