DocumentCode
2267207
Title
Design of mixed signal MCM-Ds using silicon circuit boards
Author
Hodges, Charles R. ; Benson, Donald ; Huey, Kangsen
Author_Institution
nCHIP Inc., San Jose, CA, USA
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
130
Lastpage
135
Abstract
MCM-D technologies can be used to meet the challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact of a specific silicon circuit board based MCM-D technology on these performance parameters
Keywords
integrated circuit interconnections; integrated circuit packaging; losses; mixed analogue-digital integrated circuits; multichip modules; high density interconnect; high density wirebonding; insertion loss; integral passive components; isolation; mixed signal MCM-Ds; mixed signal performance parameters; return loss; silicon circuit boards; Crosstalk; Dielectric substrates; Insertion loss; Integrated circuit interconnections; Isolation technology; Printed circuits; RF signals; Resistors; Signal design; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512016
Filename
512016
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