A novel low cost MCM-D technology

Author

Almeida ; Barnett, A.M. ; Finardi, M. ; Flacker, C.A. ; Gozzi, Antonio C. ; Molina, Jose P. ; Pagotto, A.C. ; Santos, Manuel Filipe

Author_Institution

Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil

fYear

1995

fDate

31 Jan-2 Feb 1995

Firstpage

172

Lastpage

176

Abstract

Interconnection technology has also been a key to success in the modern telecommunication systems, which are demanding more and more services, mobility, and reliability. As one knows, different technologies has been applied to solve the needs on electronic packaging, each one with its advantages and disadvantages. Telebras has evaluated them and decided to investigate an own solution. The paper describes a technological solution for fabricating MCMs developed at Telebras. It presents as main features: low cost, process simplification, reproducibility and SMD and COB assembly compatibility. This innovative approach is based on a electro-chemical copper deposition onto ceramics and conventional lithography. A general description of the processing is provided and some results and modules fabricated on alumina 96% are shown

Keywords

electrodeposition; lithography; multichip modules; Al₂O₃; COB assembly; Cu; MCM-D; SMD assembly; Telebras; alumina; ceramics; electro-chemical copper deposition; electronic packaging; interconnection technology; lithography; low cost fabrication; telecommunication system; Assembly; Ceramics; Conducting materials; Costs; Lithography; Manufacturing industries; Substrates; Surface cleaning; Telecommunications; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-6970-5

Type

conf

DOI

10.1109/MCMC.1995.512022

Filename

512022