DocumentCode
2269300
Title
EM simulation [ICs and MCMs]
Author
Das, D.V.
Author_Institution
Cadence Design Syst. (India) Pvt. Inc., Noida, India
fYear
1995
fDate
4-7 Jan 1995
Firstpage
264
Lastpage
267
Abstract
The analysis of signal integrity and emitted radiation from IC´c and MCM´s is done by solving for the electromagnetic fields as we apply input stimulus to the circuit under test. Because of the irregular nature of the interconnect in the physical layout, closed form solution of field equations is not possible. The transmission line matrix method, which is a numerical technique to solve field problems of the most general kind, is identified as a suitable method for carrying out electromagnetic simulation to analyze for signal integrity and radiation emission
Keywords
electromagnetic field theory; integrated circuit packaging; multichip modules; transmission line matrix methods; EM simulation; IC; MCM; TLM method; electromagnetic field; electromagnetic simulation; emitted radiation; signal integrity; transmission line matrix method; Circuit simulation; Circuit testing; Closed-form solution; Electromagnetic analysis; Electromagnetic fields; Electromagnetic radiation; Equations; Integrated circuit interconnections; Signal analysis; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 1995., Proceedings of the 8th International Conference on
Conference_Location
New Delhi
ISSN
1063-9667
Print_ISBN
0-8186-6905-5
Type
conf
DOI
10.1109/ICVD.1995.512121
Filename
512121
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