• DocumentCode
    2271186
  • Title

    Electron temperature dependence on electrode layer characteristics in low-pressure RF discharge

  • Author

    Lisovsky, V.A.

  • Author_Institution
    Dept. of Phys. & Technol., Kharkov Univ., Ukraine
  • fYear
    1995
  • fDate
    5-8 June 1995
  • Firstpage
    145
  • Abstract
    Summary form only given. Low-pressure RF discharges are often applied to etch semiconductor materials, to deposit diamond-like films, to pump gas lasers etc. Electron temperature T/sub e/ in the quasineutral plasma is one of the important characteristics of RF discharge. This paper reports on the relation found between T/sub e/ and electrode layer parameters for collisional and collisionless cases. We consider the collisional case when the mean free path of an ion in the electrode layer is less than the layer thickness d/sub S/. Then using the expression for the ion current density in the layer it is easy to obtain T/sub e/=C/sub 1//spl nu//sub i/pd/sub S/, where /spl nu//sub i/ is ion velocity in the layer, p is gas pressure, C/sub 1/ is constant. For the collisionless case, i.e. when an ion crosses the electrode layer without any collisions with neutral gas molecules, we employ the expression for the layer thickness d/sub S/ and the discharge current density J/sub 0/. Then T/sub e/ in the quasineutral plasma is related with d/sub S/, constant voltage drop in the layer V/sub c/ and the plasma density at the layer boundary n/sub i/ by an expression T/sub c/d/sub S//sup 4/=C/sub 2/V/sub c//sup 3//n/sub i//sup 2/, C/sub 2/=const.
  • Keywords
    electrodes; high-frequency discharges; plasma collision processes; plasma diagnostics; plasma temperature; temperature; collisional cases; collisionless cases; diamond-like film deposition; discharge current density; electrode layer characteristics; electron temperature dependence; gas laser pumping; low-pressure RF discharge; quasineutral plasma; semiconductor material etching; Current density; Electrodes; Electrons; Etching; Plasma applications; Plasma density; Plasma temperature; Radio frequency; Semiconductor materials; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1995. IEEE Conference Record - Abstracts., 1995 IEEE International Conference on
  • Conference_Location
    Madison, WI, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-2669-5
  • Type

    conf

  • DOI
    10.1109/PLASMA.1995.531583
  • Filename
    531583