Finite element analysis of the transducer vibration in die bonding operations

With the every decreasing pitch spacing of required in the microelectronic packaging industry, higher bond quality is required. In order to further understand the mechanics of the bonding operations, the vibration of the transducer is being studied to identify how bonding quality can be improved. In this paper a computational efficient method of analysing the vibration of the transducer is described, using a combination of a steady analysis and a dynamic analysis to model non linear effects of contact and resistant to motion. The initial results show that the method works, however unknown quantities such as the magnitude of the resistive force have yet to be determined in the laboratory. This model will be useful tool in designing the experiments to determine these unknowns.