• DocumentCode
    2274872
  • Title

    A WLAN/WMAN Dual Mode Transceiver System for Indoor/Outdoor Application

  • Author

    Chun, Kukjin ; Lee, Joonyeop ; Kim, Ji-Hyuk ; Kim, Hyeon Cheol ; Yoon, Kwang-Jun ; Kim, Young-Ill ; Song, In-sang

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ.
  • fYear
    2007
  • fDate
    5-7 Feb. 2007
  • Abstract
    WLAN (IEEE 802.11a)/VMAN (IEEE 802.16a) dual mode transceiver chip has been proposed, designed and fabricated. Transceiver RF IC chip with packaged size of 6 mm*6 mm was fabricated using 0.25 um SiGe BiCMOS process. Power amplifier and PLL/VCO chip were fabricated using the same process. Ceramic front-end filter were also fabricated for WLAN/WMAN frequencies. To make compact transceiver system, these chips was mounted on 2 cm*2 cm double side PCB. The full system has been tested with external ADC/DAC and baseband modem. The measured results show that fabricated transceiver system meets the requirements for WLAN/WMAN standards
  • Keywords
    WiMax; transceivers; wireless LAN; ADC/DAC; IEEE 802.11a; IEEE 802.16a; PLL/VCO chip; SiGe; SiGe BiCMOS process; WLAN; WMAN; baseband modem; ceramic front-end filter; dual mode transceiver system; power amplifier; transceiver RF IC chip; BiCMOS integrated circuits; Germanium silicon alloys; Integrated circuit packaging; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits; Silicon germanium; Transceivers; Wireless LAN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Pervasive Computing, 2007. ISWPC '07. 2nd International Symposium on
  • Conference_Location
    San Juan
  • Print_ISBN
    1-4244-0523-8
  • Electronic_ISBN
    1-4244-0523-8
  • Type

    conf

  • DOI
    10.1109/ISWPC.2007.342592
  • Filename
    4147051