A compact and low cost multilayered balun designed for SiP applications

Author

Ying, Lim Ying ; Rotaru, Mihai Dragos

Author_Institution

Inst. of Microelectron., Singapore

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

82

Lastpage

84

Abstract

In this paper, the design of a compact balun/matching network is described. The balun is built on multilayer organic laminates and found suitable for system-in-package (SiP) applications. A 2:1 balun was designed and fabricated using conventional printed circuit board (PCB) technology. In this design, the use of bridges and vias for centre tapping was eliminated, while maintaining the geometric symmetry of the spirals. Furthermore, the differential secondary coils are spread over two layers, such that the balun size can be made compact. Measurement results yield a wide bandwidth and good amplitude balance. This balun design is suitable for use in Bluetooth applications operating in the ISM band (2.4-2.5 GHz).

Keywords

Bluetooth; baluns; laminates; network synthesis; printed circuits; system-in-package; 2.4 to 2.5 GHz; Bluetooth; ISM band; SiP; centre tapping; compact balun; differential secondary coils; matching network; multilayer organic laminates; multilayered balun; printed circuit board; system-in-package; Bandwidth; Bluetooth; Bridge circuits; Coils; Costs; Impedance matching; Laminates; Nonhomogeneous media; Printed circuits; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Conference_Location

Singapore

Print_ISBN

1-4244-0664-1

Electronic_ISBN

1-4244-0665-X

Type

conf

DOI

10.1109/EPTC.2006.342695

Filename

4147224