• DocumentCode
    2278443
  • Title

    Modeling of ultra shallow junctions and hybrid source/drain profiles annealed by soak and spike RTA

  • Author

    Wang, C.C. ; Chang, C.S. ; Griffin, Peter ; Diaz, C.H.

  • Author_Institution
    Adv. Device Technol., Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    151
  • Lastpage
    154
  • Abstract
    We discuss the 1D/2D modeling of arsenic profiles under soak and spike anneal conditions at both shallow extension and high concentration source/drain areas. This work also addresses the calibration of the phosphorus profile in a hybrid (arsenic + phosphorus) source/drain with various anneal temperatures. It is shown that the "+1" or modified "+n" model is not necessary for shallow arsenic profile modeling under spike anneal conditions. Finally, it is also shown that modeling of the hybrid source/drain profile can be achieved by optimization of the dopant\´s Fermi level dependent diffusivity, initial value of point defects concentration at equilibrium state, and neglect of implant induced damage.
  • Keywords
    Fermi level; MOSFET; arsenic; diffusion; doping profiles; interstitials; phosphorus; rapid thermal annealing; semiconductor device models; vacancies (crystal); Fermi level; NMOSFET; annealing; arsenic profiles; diffusivity; hybrid source/drain profiles; phosphorus profile; point defect concentration; soak RTA; spike RTA; ultra shallow junctions; Annealing; CMOS technology; Calibration; Doping profiles; Hybrid junctions; Implants; Pulp manufacturing; Research and development; Semiconductor process modeling; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on
  • Print_ISBN
    4-89114-027-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2002.1034539
  • Filename
    1034539