Direct liquid cooling of bare die packages using a microchannel cold plate

Author

Acikalin, Tolga ; Schroeder, Carl

Author_Institution

Sort & Test Technol. Dev., Assembly & Test Technol. Dev., Chandler, AZ, USA

fYear

2014

fDate

27-30 May 2014

Firstpage

673

Lastpage

679

Abstract

A stainless steel direct liquid contact microchannel cold plate is investigated for the thermal management of bare die packages. Experiments are conducted for a prototype microchannel cold plate in contact with a 1.18cm² uniformly heated thermal test vehicle. The junction-to-fluid thermal resistance is measured to be 0.21°C/W for a water flow rate of 1 L/min thru the cold plate. Dynamic thermal characterization of the microchannel cooling solution has also been conducted and compared against static models to predict temperature response from a dynamic power profile.

Keywords

cooling; microassembling; microchannel flow; stainless steel; thermal management (packaging); thermal resistance; bare die packages; direct liquid contact; direct liquid cooling; dynamic power profile; dynamic thermal characterization; junction-to-fluid thermal resistance; microchannel cold plate; microchannel cooling solution; size 1.18 cm; stainless steel; thermal management; thermal test vehicle; water flow rate; Cold plates; Microchannels; Temperature measurement; Temperature sensors; Thermal resistance; Vehicles; cold plate; direct liquid cooling; microchannels;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2014.6892346

Filename

6892346