Effect of thermal and electromigration exposure on solder joint board level drop reliability

Author

Xu, Luhua ; Pang, John H L

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ.

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

570

Lastpage

575

Abstract

The combined sequential reliability test of thermal cycling aging or electromigration test followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. Interfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging and combined thermal-electromigration. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface

Keywords

argon; electromigration; printed circuit testing; reliability; solders; sputter etching; thermal management (packaging); tin alloys; voids (solid); Ar; Ar+ sputtering etching; Kirkendall voids formation; SnAgCu; electromigration exposure; electromigration test; interconnect failure mode; interfacial IMC; sequential reliability test; solder joint board level drop reliability; solder joint interface; thermal cycling aging; thermal exposure; thermal-electromigration; Aerospace testing; Aging; Assembly; Circuit testing; Electromigration; Environmentally friendly manufacturing techniques; Integrated circuit interconnections; Lead; Sequential analysis; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Conference_Location

Singapore

Print_ISBN

1-4244-0664-1

Electronic_ISBN

1-4244-0665-X

Type

conf

DOI

10.1109/EPTC.2006.342776

Filename

4147305