• DocumentCode
    2280311
  • Title

    Methodology of testability design of electronic components based on the boundary-scan method?

  • Author

    Ren, Zhanyong ; Liu, Dandan ; Zeng, Zhaoyang

  • Author_Institution
    China Avic Aero-polytechnology Establ., Beijing, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    1088
  • Lastpage
    1092
  • Abstract
    The complex electronic components should be tested during either the period of design and manufacture or the period of debugging and running to ensure that their application quality meet the requirements. However, the traditional testing technology encounters tremendous difficulties and the cost of testing is expensive with the rapidly development of the electronic components´ integrated technology and the increase of the complexity of their own. Academic research and testing practice indicate that the problem of testing for the electronic components can be predigested and eventually solved no other than improving the testability design of the electronic components. In this paper, at first, the basic principle and the testing flow of the boundary-scan method are introduced. Then, fault models of the electronic components and mathematical model for the boundary-scan test are put forward. Based on the above knowledge, the generation of test vectors and analysis method of the response belonged to the boundary-scan method are introduced in the following. At last, the testability design based on boundary-scan belonged to a complex electronic component is presented.
  • Keywords
    boundary scan testing; design for testability; fault diagnosis; integrated circuit testing; academic research; application quality; boundary-scan method; boundary-scan test; complex electronic components; debugging period; fault models; mathematical model; test vector generation; testability design; testing flow; testing practice; traditional testing technology; Bridge circuits; Circuit faults; Electronic components; Mathematical model; Random access memory; Registers; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582729
  • Filename
    5582729