DocumentCode
2280311
Title
Methodology of testability design of electronic components based on the boundary-scan method?
Author
Ren, Zhanyong ; Liu, Dandan ; Zeng, Zhaoyang
Author_Institution
China Avic Aero-polytechnology Establ., Beijing, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
1088
Lastpage
1092
Abstract
The complex electronic components should be tested during either the period of design and manufacture or the period of debugging and running to ensure that their application quality meet the requirements. However, the traditional testing technology encounters tremendous difficulties and the cost of testing is expensive with the rapidly development of the electronic components´ integrated technology and the increase of the complexity of their own. Academic research and testing practice indicate that the problem of testing for the electronic components can be predigested and eventually solved no other than improving the testability design of the electronic components. In this paper, at first, the basic principle and the testing flow of the boundary-scan method are introduced. Then, fault models of the electronic components and mathematical model for the boundary-scan test are put forward. Based on the above knowledge, the generation of test vectors and analysis method of the response belonged to the boundary-scan method are introduced in the following. At last, the testability design based on boundary-scan belonged to a complex electronic component is presented.
Keywords
boundary scan testing; design for testability; fault diagnosis; integrated circuit testing; academic research; application quality; boundary-scan method; boundary-scan test; complex electronic components; debugging period; fault models; mathematical model; test vector generation; testability design; testing flow; testing practice; traditional testing technology; Bridge circuits; Circuit faults; Electronic components; Mathematical model; Random access memory; Registers; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582729
Filename
5582729
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