• DocumentCode
    2283417
  • Title

    Self-heating effects on SOI devices and implication to parameter extraction

  • Author

    Yachou, D. ; Gautier, J. ; Raynaud, C.

  • Author_Institution
    Lab d´´Electron. et de Technol. de l´´Inf., CEA, Centre d´´Etudes Nucleaires de Grenoble, France
  • fYear
    1993
  • fDate
    5-7 Oct 1993
  • Firstpage
    148
  • Lastpage
    149
  • Abstract
    In SOI devices heat dissipation is limited by a buried oxide layer. The consequence is the well known Self Heating (SH) phenomenon. We have analysed in depth the corresponding thermal effects on static and dynamic modes and the implications for the device operation. In this paper the original contributions are the following: decorrelation of temperature effects on the drain current via temperature dependence of mobility and impact ionization generation rate Gii. This results in a comprehensive explanation of the output conductance attenuation with increasing gate voltage (Vgs). Analysis of displacement current effects, SH and impact ionization on transient device operation. Application to device modeling: proposal of a method for the parameters extraction that takes into account the nonlinear distortion of static output characteristics due to the SH phenomenon. The self-heating analysis, in this paper, is related to a 0.8 μm technology on SIMOX substrate developed by LETI-CEA. The devices are enhancement mode n-channel MOSFETs
  • Keywords
    carrier mobility; impact ionisation; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; silicon; thermal analysis; 0.8 micron; LETI-CEA; SIMOX substrate; SOI devices; Si; buried oxide layer; device modeling; displacement current effects; drain current; enhancement mode; heat dissipation; impact ionization generation rate; mobility; n-channel MOSFETs; nonlinear distortion; output conductance attenuation; parameter extraction; self-heating effects; static output characteristics; temperature dependence; temperature effects; thermal effects; transient device operation; Attenuation; Decorrelation; Heating; Impact ionization; Nonlinear distortion; Parameter extraction; Proposals; Temperature dependence; Transient analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1993. Proceedings., 1993 IEEE International
  • Conference_Location
    Palm Springs, CA
  • Print_ISBN
    0-7803-1346-1
  • Type

    conf

  • DOI
    10.1109/SOI.1993.344557
  • Filename
    344557