• DocumentCode
    2284314
  • Title

    Partial discharge stressing of filled epoxy resin surfaces

  • Author

    Hepburn, D.M. ; Kemp, I.J. ; Richardson, R.T.

  • Author_Institution
    Glasgow Caledonian Univ., UK
  • fYear
    1996
  • fDate
    23-26 Sep 1996
  • Firstpage
    330
  • Lastpage
    333
  • Abstract
    The work described herein investigates the effect of both partial discharge and chemical/radiation stressing on a bisphenol-A epoxy resin which has had one of three fillers added. The three fillers selected for investigation were alumina (Al2O3), silica (SiO 2) and wollastonite (CaSiO3). These three fillers were selected to cover the range of shape of particle and acidity of filler material commonly in use in industry today
  • Keywords
    surface discharges; acidity; bisphenol-A epoxy resin surface; chemical stress; inorganic filler; partial discharge; particle shape; radiation stress;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Dielectric Materials, Measurements and Applications, Seventh International Conference on (Conf. Publ. No. 430)
  • Conference_Location
    Bath
  • ISSN
    0537-9989
  • Print_ISBN
    0-85296-670-9
  • Type

    conf

  • DOI
    10.1049/cp:19961052
  • Filename
    607411
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2284314