• DocumentCode
    2284377
  • Title

    PCB trace modeling and equalizer design method for 10 Gbps backplane

  • Author

    Muraoka, Satoshi ; Shinkai, Go ; Yagyu, Masayoshi ; Uematsu, Yutaka ; Ogihara, Masao ; Sezaki, Naohiro ; Osaka, Hideki

  • Author_Institution
    Yokohama Res. Lab., Hitachi Ltd., Yokohama, Japan
  • fYear
    2011
  • fDate
    12-14 Dec. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper discusses accurate PCB modeling methods for 10 Gbps differential signal traces. We added two approaches to the conventional modeling method: (1) We simulated the glass cloth and epoxy distribution in the PCB dielectric to simulate common/differential mode conversion noise (SCD21). (2) We applied a frequency-dependent dielectric constant to the electromagnetic analysis model based on a Djordjevic-Sarkar model to introduce a frequency-dependent group delay. Applying these two additional modeling elements, we obtained accurate SCD21 and jitter properties consistent with measurement results. We also demonstrated an equalizer design based on the improved PCB model. By flattening the frequency dependence of the group delay as well as trace losses for the transmission paths, including the equalizer, by adjusting the properties of the peaking amplifier for the equalizer circuit, we reduced jitter by up to 10 ps for 10 Gbps signalling.
  • Keywords
    equalisers; printed circuit design; Djordjevic-Sarkar model; PCB dielectric; PCB equalizer design method; PCB trace modeling; SCD21; bit rate 10 Gbit/s; common-differential mode conversion noise; differential signal traces; electromagnetic analysis model; epoxy distribution; equalizer circuit; frequency dependence; frequency-dependent group delay; glass cloth; jitter properties; peaking amplifier properties; transmission paths; Backplanes; Delay; Equalizers; Frequency dependence; Glass; Noise; Permittivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
  • Conference_Location
    Hanzhou
  • ISSN
    2151-1225
  • Print_ISBN
    978-1-4673-2288-1
  • Electronic_ISBN
    2151-1225
  • Type

    conf

  • DOI
    10.1109/EDAPS.2011.6213769
  • Filename
    6213769