Analytical extraction of via-via inductance by using SMM for power-ground planes

Author

Luo, Guang-Xiao ; Wei, Xing-Chang ; Cui, Xiang ; Li, Er-Ping

Author_Institution

North China Electr. Power Univ., Beijing, China

fYear

2011

fDate

12-14 Dec. 2011

Firstpage

1

Lastpage

4

Abstract

In this paper, the via-via inductance between power-ground plane in printed circuit board is extracted analytically by using the scattering matrix method (SMM). A gap voltage source is used to excited the higher order modes between parallel plates, by solving the linear scattering matrix equation, the scattered wave coefficient is obtained, furthermore, the admittance parameter between two vias is calculated, and the analytical inductance formula with frequency dependence is obtained and validated by quasi-static numerical method.

Keywords

S-matrix theory; electric admittance; inductance; printed circuits; SMM; admittance parameter; analytical extraction; analytical inductance formula; frequency dependence; gap voltage source; higher order modes; linear scattering matrix equation; parallel plates; power-ground planes; printed circuit board; quasi-static numerical method; scattered wave coefficient; scattering matrix method; via-via inductance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Conference_Location

Hanzhou

ISSN

2151-1225

Print_ISBN

978-1-4673-2288-1

Electronic_ISBN

2151-1225

Type

conf

DOI

10.1109/EDAPS.2011.6213810

Filename

6213810