Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

Author

Chan, Y.C. ; Hung, K.C. ; Tang, C.W. ; Wu, C.M.L.

Author_Institution

Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, China

fYear

2000

fDate

2000

Firstpage

141

Lastpage

146

Abstract

Flip chip on flex (FCOF) using anisotropic conductive film (ACF) has been demonstrated. Two types of conductive particle in ACF are used in this paper to investigate the effect of pinholes of the electroless nickel bumps on electrical connection of ACF joints of FCOF samples. The conduction mechanisms of both types of ACF joint due to the effect of pinholes have been discussed. After high temperature and high humidity storage, Ni filled and Au/Ni coated polymer filled ACF joints using non-aged or aged bump chips show slightly and dramatic increases in connection resistance respectively. Detail degradation mechanisms for these ACF joints have been proposed

Keywords

adhesives; ageing; conducting polymers; flip-chip devices; humidity; integrated circuit reliability; ACF joints; Au-Ni; aged bump chips; anisotropic conductive adhesive joints; conduction mechanisms; conductive particle; connection resistance; degradation mechanisms; electroless nickel bumps; flip chip on flex applications; humidity; pinholes; Anisotropic conductive films; Anisotropic magnetoresistance; Conductive adhesives; Degradation; Flip chip; Gold; Humidity; Nickel; Polymer films; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on

Conference_Location

Espoo

Print_ISBN

0-7803-6460-0

Type

conf

DOI

10.1109/ADHES.2000.860588

Filename

860588