• DocumentCode
    2304370
  • Title

    Epoxy adhesives with soldering properties

  • Author

    Läntzsch, Michael

  • Author_Institution
    Litton Kester Solder Europe, Gernlinden, Germany
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    168
  • Lastpage
    173
  • Abstract
    There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component
  • Keywords
    adhesives; conducting polymers; encapsulation; flip-chip devices; soldering; epoxy adhesives; epoxy resins; full mechanical reinforcement; harmful residues; mechanical reinforcement; partial mechanical reinforcement; protective residue; soldering properties; Assembly; Curing; Environmentally friendly manufacturing techniques; Epoxy resins; Europe; Flip chip; Soldering; Temperature; Thermal conductivity; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
  • Conference_Location
    Espoo
  • Print_ISBN
    0-7803-6460-0
  • Type

    conf

  • DOI
    10.1109/ADHES.2000.860593
  • Filename
    860593