DocumentCode
2304370
Title
Epoxy adhesives with soldering properties
Author
Läntzsch, Michael
Author_Institution
Litton Kester Solder Europe, Gernlinden, Germany
fYear
2000
fDate
2000
Firstpage
168
Lastpage
173
Abstract
There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component
Keywords
adhesives; conducting polymers; encapsulation; flip-chip devices; soldering; epoxy adhesives; epoxy resins; full mechanical reinforcement; harmful residues; mechanical reinforcement; partial mechanical reinforcement; protective residue; soldering properties; Assembly; Curing; Environmentally friendly manufacturing techniques; Epoxy resins; Europe; Flip chip; Soldering; Temperature; Thermal conductivity; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860593
Filename
860593
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