DocumentCode
2304507
Title
Electric field effects in the production of ICA joints
Author
Heuschkel, Mark D. ; Morris, James E.
Author_Institution
Fac. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
fYear
2000
fDate
2000
Firstpage
212
Lastpage
215
Abstract
Concern over the use of toxic lead in electronic devices is driving research into lead free solder alloys and isotropic electrically conductive adhesives (ICAs). To replace the common solders with ICAs, it is both essential to know the behavior of the material during assembly process, and useful to be able to exert any form of control which will yield improved properties. The paper describes the possible influence of an electric field applied to the ICA during curing
Keywords
adhesives; assembling; conducting polymers; electric field effects; electric resistance; filled polymers; heat treatment; packaging; ICA joints; assembly process; curing; electric field effects; isotropic electrically conductive adhesives; Assembly; Conductive adhesives; Curing; Electric resistance; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Production; Silver; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860602
Filename
860602
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