Processing, structural and electrical properties of electrically conductive adhesives

Author

Kim, Hansoo ; Li, Li ; Lizzul, Christine ; Sacolick, Isaac ; Morris, J.E.

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

311

Lastpage

319

Abstract

There is growing interest in the potential of electrically conducting metal-loaded polymer adhesives for solder replacement in electrical lead attachment. Eight commercial electrically conductive adhesive (ECA) pastes were selected for study, including both thermosetting and thermoplastic examples. All were silver based, except for one nickel-polymer composite

Keywords

adhesion; conducting polymers; electrical resistivity; filled polymers; lead bonding; plastic packaging; polymer structure; DC resistance; bulk resistivity; electrical lead attachment; electrical properties; electrically conductive adhesives; frequency dependence; metal-loaded polymer adhesives; nickel-polymer composite; nonohmic behavior; resistivity temperature dependence; silver-polymer composite; solder replacement; structural properties; thermoplastic paste; thermosetting paste; Assembly; Circuit testing; Conductive adhesives; Conductivity; Costs; Lead; Polymers; Silver; Temperature sensors; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346687

Filename

346687