Packaging and reliability of photonic components for subscriber network systems

Author

Yoshida, Junichi ; Yamada, Yasufumi ; Terui, Hiroshi

Author_Institution

NTT Opto-Electron. Labs., Ibaraki, Japan

fYear

1993

fDate

1-4 Jun 1993

Firstpage

785

Lastpage

789

Abstract

This paper describes packaging of photonic components called planar lightwave circuit (PLC) optical waveguides on a silicon substrate, using a UV-curable epoxy adhesive, and reliability test results on two types of photonic integrated components; optical coupler module and WDM optical transmitter/receiver module. These modules exhibited good stability after high humidity stress tests or temperature cycle stress tests

Keywords

integrated optics; optical communication equipment; optical couplers; optical fibres; optical links; optical receivers; optical waveguides; packaging; subscriber loops; wavelength division multiplexing; UV-curable epoxy adhesive; WDM optical transmitter/receiver module; high humidity stress tests; optical coupler module; optical waveguides; packaging; photonic components; photonic integrated components; planar lightwave circuit; reliability; reliability test; stability; subscriber network systems; temperature cycle stress tests; Circuit testing; Integrated circuit reliability; Integrated optics; Optical devices; Optical receivers; Optical transmitters; Optical waveguides; Packaging; Programmable control; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346760

Filename

346760