DocumentCode
2306450
Title
Effects of a reduction treatment and Te doping on thermoelectric properties of (Bi1-xSbx)2Te3 fabricated by mechanical alloying
Author
Kim, Hang-Chong ; Choi, Jae-Shik ; Kim, Hee-Jeong ; Hyun, Dow-Bin ; Oh, Tae-Sung
Author_Institution
Dept. of Metall. Eng. & Mater. Sci., Hong Ik Univ., Seoul, South Korea
fYear
1997
fDate
26-29 Aug 1997
Firstpage
127
Lastpage
130
Abstract
(Bi1-xSbx)2Te3 (0.75⩽x⩽0.85) thermoelectric materials were fabricated by mechanical alloying and hot pressing at 550°C for 30 minutes with and without reduction treatment of the mechanically alloyed powders. When the mechanically alloyed (Bi1-xSbx)2 Te3 powders were hot-pressed without a reduction treatment, a maximum figure-of-merit of 2.92×10-3/K at 300 K was obtained for x=0.8 composition. Although the electrical resistivity of the mechanically alloyed (Bi1-xSbx) 2Te3 decreased with a reduction treatment of the powders, the figure-of-merit was lowered due to the substantial decrease of the Seebeck coefficient. With addition of 1 wt% excess Te, the figure-of-merit of the reduction-treated (Bi0.2Sb0.8 )2Te3 could be improved to be 3.33×10 -3/K
Keywords
Seebeck effect; antimony compounds; bismuth compounds; electrical resistivity; hot pressing; mechanical alloying; semiconductor materials; thermoelectric power; (Bi1-xSbx)2Te3; (BiSb)2Te3; 30 min; 300 K; 550 C; Seebeck coefficient; Te doping; electrical resistivity; figure-of-merit; hot pressing; mechanical alloying; reduction treatment; thermoelectric properties; Alloying; Atmosphere; Bismuth; Doping; Electric resistance; Magnetic field measurement; Powders; Tellurium; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location
Dresden
ISSN
1094-2734
Print_ISBN
0-7803-4057-4
Type
conf
DOI
10.1109/ICT.1997.666991
Filename
666991
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