New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip

Recently, the use of high-density mounting and multi-function design have been rapidly progressing on the industry. For metal board, the chip on board (COB) method has been widely employed with which a silicon chip is directly connected to a metal board by use of the wire bonding method. However, conventional metal boards are insufficient with respect to reliability. We have succeeded in the development of metal board having a high reliability by using a compound material high-purity, of a high-function naphthalene epoxy resin and an aramid paper from PPODTA (Co-poly-paraphenylene 3,4-oxydiphenylene terephthalamide) for its insulating layer which is the most important part with respect to reliability. The metal board is excellent in heat resistance and heat dissipation, and particularly in migration resistance. Its coefficient of linear expansion is 6 ppm board can be expected to be applied for advanced surface mounting technologies, such as LCCC, COB, Flip Chip, PGA, MCM (Multi Chip Module) and TAB. These applications are automobiles, air conditioners, air craft, space satellite, rocket and small-sized motors