DocumentCode
2309241
Title
Validating the performance of a 32nm CMOS high speed serial link receiver with adaptive equalization and baud-rate clock data recovery
Author
Puligundla, Sudeep ; Spagna, Fulvio ; Chen, Lidong ; Tran, Amanda
Author_Institution
Intel, Hillsboro, OR, USA
fYear
2010
fDate
2-4 Nov. 2010
Firstpage
1
Lastpage
5
Abstract
On-Die features available for validation and test on an integrated circuit play a major role in evaluating the performance of the functionality being realized by the circuit in a post-silicon environment and can considerably reduce time to market of the end-product. In the case of high-speed IO, it is also important to note that the type of on-die hooks required to debug and validate the performance and robustness of the design depend on several factors, of which the type of I/O architecture chosen plays a key role. In order to support high data rates, the serial I/O design in this paper implements a receiver with adaptive equalization engine for the compensation of inter-symbol interference (ISI) and real-time environmental changes (temperature and voltage). This paper describes the debug hooks and their usage models in such a high-speed I/O designed using a 32nm CMOS process. These hooks have been tested in the lab and proven to be very useful. While the main focus of the paper is to describe the hooks, how they are used in the lab for observing the robustness in the dynamic behavior of the adaptive loops and the measurement results; the reader is also provided with a brief insight into the equations describing the loops behavior together with a description of the loops implementation details.
Keywords
CMOS integrated circuits; adaptive equalisers; clock and data recovery circuits; intersymbol interference; receivers; CMOS; I/O architecture; adaptive equalization; baud-rate clock data recovery; integrated circuit; inter-symbol interference; on-die features; serial link receiver; AGC and CDR; LMS algorithm; adaptive equalization; decision-feedback equalizer; design for validation; high speed serial link; on-die debug hooks;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference (ITC), 2010 IEEE International
Conference_Location
Austin, TX
ISSN
1089-3539
Print_ISBN
978-1-4244-7206-2
Type
conf
DOI
10.1109/TEST.2010.5699242
Filename
5699242
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