Development of a 20 μm pitch high frequency contact probe

We have developed a fine pitch high-frequency contact probe. For the probe tip part, GS type contact electrodes are formed with 20-μm-pitch coplanar strips on a printed wiring board. The fine pitch probe tip part is attached on a semi-rigid coaxial cable by soldering. The other probe structure is as the same as a conventional high-frequency contact probe. We measured its high-frequency characteristics by using high resolution time domain reflectometry (TDR) measurement system. The SPICE circuit simulation model was evaluated using a TDR waveform analyzing software. The practical measurement of a 3D LSI stacking interposer including 10-μm-wide wiring structure was demonstrated using the developed fine pitch high-frequency contact probe.