DocumentCode
2311714
Title
An approach to develop high-Tg epoxy resins for halogen-free copper clad laminates
Author
Lin, Hung Tse ; Lin, Ching Hsuan ; Hu, Yu Ming
Author_Institution
Dept. of Chem. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
In this paper, by combining the structures of epoxy and benzoxazine, we report a method of preparing multifunctional epoxy resins without decreasing the overall number of functionality. Herein, a phosphorus-containing benzoxazine (1) with a hydroxyl linkage was designed. Based on (1), a series of advanced epoxy resins (2) with various phosphorus contents were prepared by the nucleophilic addition phenolic OH of (1) on the oxirane of CNE. In addition, the effect of reaction conditions on the preparation of (2) was monitored by EEW titration and NMR analysis. In our study, although the number of functionality of oxirane was reduced after the nucleophilic addition, the overall number of functionality of the resulting resins was not reduced because a curable benzoxazine linkage was also incorporated after the addition. In other words, the overall number of functionality was maintained after incorporating the phosphorus element. As a result, flame retardant thermosets with high Tg can be expected. After (2) curing with 4,4´-diaminediphenyl sulfone (DDS) or dicyanodiamine (DICY), the thermal properties, dimensional stability and flame retardancy of the resulting epoxy thermosets were evaluated. Based on these promising resins, manufacturing of flame-retardant copper clad laminates is in progress.
Keywords
association; curing; flame retardants; laminates; proton magnetic resonance; resins; 4,4´-diaminediphenyl sulfone; EEW titration; NMR analysis; advanced epoxy resins; curing; dicyanodiamine; dimensional stability; flame retardancy; flame retardant thermosets; halogen-free copper clad laminates; high-Tg epoxy resins; nucleophilic addition phenolic OH; oxirane; phosphorus-containing benzoxazine; thermal properties;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699521
Filename
5699521
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