DocumentCode
2311924
Title
Effect of Creep Properties on Pressure Induced Tin Whisker Formation
Author
Shibutani, Tadahiro ; Yu, Qiang ; Shiratori, Masaki
Author_Institution
Yokohama Nat. Univ., Yokohama
fYear
2008
fDate
14-17 July 2008
Firstpage
197
Lastpage
198
Abstract
This paper presents the effect of creep properties on pressure-induced tin whisker formation. Creep properties of bright SnPb and SnCu finishes were evaluated by using a nanoindentation test. At the early stage of indentation, power law creep has a small scatter in both plating finishes. On the other hands, diffusion creep in SnCu show big scatter than SnPb. This behavior can explain the whisker formation on SnCu.
Keywords
copper alloys; diffusion creep; indentation; lead alloys; tin alloys; whiskers (crystal); SnCu; SnPb; creep properties; diffusion creep; nanoindentation test; power law; pressure induced tin whisker formation; Acceleration; Compressive stress; Conductors; Connectors; Creep; Environmentally friendly manufacturing techniques; Power engineering and energy; Reliability engineering; Scattering; Tin; creep; lead-free; pressure; tin whisker; tin-copper; tin-lead;
fLanguage
English
Publisher
ieee
Conference_Titel
Secure System Integration and Reliability Improvement, 2008. SSIRI '08. Second International Conference on
Conference_Location
Yokohama
Print_ISBN
978-0-7695-3266-0
Electronic_ISBN
978-0-7695-3266-0
Type
conf
DOI
10.1109/SSIRI.2008.25
Filename
4579822
Link To Document