Microminiature thermionic vacuum tube diodes

Author

Sadwick, L.P. ; Zhang, Y.J. ; Schaeffer, D.J. ; Holmes, S.G. ; Petelenz, D.G. ; Hwu, R.J.

Author_Institution

Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA

fYear

1993

fDate

5-8 Dec. 1993

Firstpage

769

Lastpage

772

Abstract

Details on the fabrication and testing of microminiature thermionic vacuum tube devices (i.e., diodes, triodes) with ultra-small (i.e., micron-scale) dimensions will be presented. The microminiature thermionic vacuum (MTV) devices can either have a direct or indirect heated cathode with an air-bridge filament supplying the thermal energy. Single device element architecture can consist of either a totally vertical structure or a combination of planar and vertical structures. The MTV devices are well suited to harsh environments and have the potential to operate at frequencies approaching the terahertz range.<>

Keywords

diodes; thermionic cathodes; thermionic tubes; air-bridge filament; direct heated cathode; fabrication; harsh environments; indirect heated cathode; microminiature thermionic vacuum tube diodes; planar structure; single device element architecture; tershertz frequencies; testing; ultra-small micron-scale dimensions; vertical structure; Cathodes; Computer displays; Electron emission; Electron tubes; Fabrication; Microscopy; Semiconductor devices; Semiconductor diodes; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International

Conference_Location

Washington, DC, USA

ISSN

0163-1918

Print_ISBN

0-7803-1450-6

Type

conf

DOI

10.1109/IEDM.1993.347200

Filename

347200