• DocumentCode
    2312619
  • Title

    Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings

  • Author

    Zhu, S.-W. ; Shih, C.-P. ; Chiu, T.-C. ; Shen, G.S.

  • Author_Institution
    Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2.
  • Keywords
    delamination; electronics packaging; fatigue cracks; fracture mechanics; interconnections; mechanical testing; polymers; silicon compounds; DCB; SiN; custom-developed microtester; delamination fracture characteristics; double cantilever beam test; elastic foundation-based closed-form expression; fatigue loading; polyimide-related interface; strain energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699574
  • Filename
    5699574