DocumentCode
2312619
Title
Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings
Author
Zhu, S.-W. ; Shih, C.-P. ; Chiu, T.-C. ; Shen, G.S.
Author_Institution
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2.
Keywords
delamination; electronics packaging; fatigue cracks; fracture mechanics; interconnections; mechanical testing; polymers; silicon compounds; DCB; SiN; custom-developed microtester; delamination fracture characteristics; double cantilever beam test; elastic foundation-based closed-form expression; fatigue loading; polyimide-related interface; strain energy;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699574
Filename
5699574
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