DocumentCode
2313970
Title
Structure and method of forming pillar bumps with controllable shape and size
Author
Hsu, Hou-Jun ; Huang, Jung-Tang ; Lee, Kuo-Yu ; Tsai, Ting-Chiang
Author_Institution
Inst. of Mech. & Electr. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
5
Abstract
This paper relates to the method of formation and structure of pillar bump with shape and dimension controllable, it specifically relates to a technique that uses polishing and planarization technique to let all pillar bumps have dimension and shape matching the design.
Keywords
planarisation; polishing; wafer level packaging; controllable shape; controllable size; pillar bump formation; pillar bump structure; planarization; polishing; shape matching; Copper; Packaging; Patents; Planarization; Shape; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699657
Filename
5699657
Link To Document