DocumentCode
2314054
Title
Using Thermoelectric Cooling Chip (T.E.C.) to improve the stability of the Heat Pipe Performance Test Instrument
Author
Lin, Wei-Keng ; Wang, Pen-Cheng ; Wang, H.P.
Author_Institution
Eng. & Syst. Sci. Dept., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
Heat pipe is a device of high heat-conduction. It mainly uses inside fluid to carry heat energy while the phase is changing. It´s a tool which can transmit a large amount of heat energy in operating temperature while phase is changing. Therefore, heat pipe also named the superconductor. The major purpose of this study is to analyze the affect of the condenser parameters to Heat Pipe Performance. A T.E.C. controller (Thermoelectric Cooling Chip Controller) to measure the condenser section of HPPTI (Heat Pipe Performance Test Instrument) is developed in this study, which can exactly control the temperature in adiabatic section and condenser section very accurately. The experimental results show the maximum heat loading controlled by T.E.C. is the same as that of controlled by water cooling, but the test time is reduce from 7 hours to 3.5 hour, and the final target for test time we expected will be achieved within 20 minutes.
Keywords
cooling; heat conduction; heat losses; heat pipes; thermoelectric devices; condenser parameters; heat energy; heat pipe performance test instrument; heat-conduction; stability; thermoelectric cooling chip; Heat Pipe; Maximum Heat Loading; Thermoelectric Chip; heat loss;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699661
Filename
5699661
Link To Document