• DocumentCode
    2314054
  • Title

    Using Thermoelectric Cooling Chip (T.E.C.) to improve the stability of the Heat Pipe Performance Test Instrument

  • Author

    Lin, Wei-Keng ; Wang, Pen-Cheng ; Wang, H.P.

  • Author_Institution
    Eng. & Syst. Sci. Dept., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Heat pipe is a device of high heat-conduction. It mainly uses inside fluid to carry heat energy while the phase is changing. It´s a tool which can transmit a large amount of heat energy in operating temperature while phase is changing. Therefore, heat pipe also named the superconductor. The major purpose of this study is to analyze the affect of the condenser parameters to Heat Pipe Performance. A T.E.C. controller (Thermoelectric Cooling Chip Controller) to measure the condenser section of HPPTI (Heat Pipe Performance Test Instrument) is developed in this study, which can exactly control the temperature in adiabatic section and condenser section very accurately. The experimental results show the maximum heat loading controlled by T.E.C. is the same as that of controlled by water cooling, but the test time is reduce from 7 hours to 3.5 hour, and the final target for test time we expected will be achieved within 20 minutes.
  • Keywords
    cooling; heat conduction; heat losses; heat pipes; thermoelectric devices; condenser parameters; heat energy; heat pipe performance test instrument; heat-conduction; stability; thermoelectric cooling chip; Heat Pipe; Maximum Heat Loading; Thermoelectric Chip; heat loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699661
  • Filename
    5699661