DocumentCode
2315696
Title
Characterisation of partial discharge behaviour in liquid nitrogen
Author
Swaffield, D.J. ; Lewin, P.L. ; Tian, Y. ; Chen, G. ; Swingler, S.G.
Author_Institution
Electron. & Comput. Sci., Southampton Univ., UK
fYear
2004
fDate
19-22 Sept. 2004
Firstpage
135
Lastpage
138
Abstract
Interest in superconductors for use in the transmission and distribution of power has grown since the advent of high temperature superconductors (HTS). The benefits of reduced ohmic losses leading to greater operational efficiency appear attractive to power transmission and distribution companies. Potentially this technology will increase power transfer for the same or lower voltage and for the same or smaller physical dimensions. For the successful employment of this technology in the field, power utilities must be convinced of the operational reliability of designs. Many of these designs make use of liquid nitrogen as the system coolant and also as a dielectric fluid. It is therefore vital that liquid nitrogen be well characterised as a dielectric medium. This work describes an experiment to characterise partial discharge behaviour in a nonuniform field geometry. A technique is described which allows synchronised capture and measurement of apparent charge and images of density change streamer activity. A φqn analysis of AC results has been completed and characterisation of partial discharge behaviour is presented and discussed.
Keywords
coolants; dielectric liquids; high-temperature superconductors; insulation testing; nitrogen; partial discharge measurement; HTS; N; charge measurement; coolant; dielectric fluid; high temperature superconductors; liquid nitrogen; ohmic losses; partial discharge measurement; power distribution; power transfer; power transmission; power utility; Coolants; Dielectric liquids; Employment; High temperature superconductors; Nitrogen; Partial discharges; Power system reliability; Power transmission; Propagation losses; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
ISSN
1089-084X
Print_ISBN
0-7803-8447-4
Type
conf
DOI
10.1109/ELINSL.2004.1380488
Filename
1380488
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