• DocumentCode
    2324742
  • Title

    An interpolatory spectral element method using curl-conforming vector basis functions on tetrahedra

  • Author

    Lin, Xi ; Olson, Luke ; Jin, Jianming

  • Author_Institution
    Univ. of Illinois at Urbana-Champaign, Urbana
  • fYear
    2007
  • fDate
    9-15 June 2007
  • Firstpage
    5095
  • Lastpage
    5098
  • Abstract
    The Nedelec basis functions are commonly used in the finite element solution of electromagnetic field problems. Higher-order Nedelec-type of basis functions are constructed to be either hierarchical or interpolatory. Due to a lack of an explicit expression for interpolation functions through an arbitrary set of nodes on a tetrahedron, equispaced nodes, for which explicit expressions do exist, are commonly used in the finite element formulation. The poor interpolation properties of those functions make the finite element matrices poorly conditioned for higher orders. Here we use the Vandermonde matrix to express the interpolatory vector basis on an arbitrary set of nodes in terms of a hierarchical basis utilizing orthonormal polynomials on a tetrahedron. In an effort to increase efficiency, integration and differentiation operations are developed using matrix-matrix multiplications. Numerical results are given which verify the efficacy of the approach.
  • Keywords
    differentiation; electromagnetic field theory; finite element analysis; integration; interpolation; matrix algebra; polynomials; vectors; Nedelec basis functions; Vandermonde matrix; curl-conforming vector basis functions; differentiation; electromagnetic field problems; finite element solution; integration; interpolatory spectral element method; interpolatory vector; orthonormal polynomials; tetrahedron; Computer science; Electromagnetic fields; Electrostatics; Finite element methods; Interpolation; Numerical analysis; Polynomials; Standards development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2007 IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-0877-1
  • Electronic_ISBN
    978-1-4244-0878-8
  • Type

    conf

  • DOI
    10.1109/APS.2007.4396692
  • Filename
    4396692