DocumentCode
232560
Title
Methodology of power integrity analysis for high speed PCB design
Author
Yee Chang Fei
Author_Institution
Keysight Technol., Bayan Lepas, Malaysia
fYear
2014
fDate
19-21 Aug. 2014
Firstpage
132
Lastpage
136
Abstract
This paper studies the methodology of power integrity (PI) analysis for high speed printed circuit board (PCB) design. This involves the analysis of AC and DC characteristic of the PCB, and also the loop stability of the switch mode voltage source. Besides this, the best practices of designing a power rail with excellent fidelity are discussed in detail in this paper. The basic theory of operation of the switch mode voltage source and the concept of loop stability are also discussed. The results of simulated PI DC and AC analysis of PCB using Hyperlynx from Mentor Graphic, simulated and measured loop stability and transient response of switch mode voltage source are presented in this paper.
Keywords
circuit stability; printed circuit design; AC characteristic analysis; DC characteristic analysis; Hyperlynx; Mentor Graphic; PI analysis; high speed PCB design; loop stability; power integrity analysis; power rail design; printed circuit board; switch mode voltage source; transient response; Capacitors; Gain; Impedance; Noise; Rails; Stability analysis; Switches; loop gain; loop phase; loop stability; power distribution network; power integrity; switch mode voltage source; switching frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Design (ICED), 2014 2nd International Conference on
Conference_Location
Penang
Type
conf
DOI
10.1109/ICED.2014.7015785
Filename
7015785
Link To Document