DocumentCode
2326952
Title
The influence of a top cover on the leakage from microstrip line
Author
Mesa, F. ; Oliner, A.A. ; Jackson, D.R. ; Freire, M.J.
Author_Institution
Seville Univ., Spain
Volume
3
fYear
2000
fDate
11-16 June 2000
Firstpage
1667
Abstract
When a microwave integrated circuit is enclosed in a package, the top cover causes the transmission lines used in the circuit to become leaky at a lower frequency than otherwise. This effect is found to be particularly dramatic for microstrip line, and the leakage is strong enough to produce crosstalk that can ruin the performance of the circuit.
Keywords
Crosstalk; Integrated circuit packaging; Microstrip lines; Microwave integrated circuits; IC package; MIC; crosstalk; leaky transmission lines; microstrip line leakage; microwave IC; microwave integrated circuit; top cover; Crosstalk; Dielectric substrates; Distributed parameter circuits; Frequency; Integrated circuit packaging; Microstrip; Microwave integrated circuits; Power transmission lines; Solids; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location
Boston, MA, USA
ISSN
0149-645X
Print_ISBN
0-7803-5687-X
Type
conf
DOI
10.1109/MWSYM.2000.862298
Filename
862298
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