DocumentCode
2327747
Title
Characterization of surface mount packages at microwave frequencies using wafer probes
Author
Godshalk, E.M.
Author_Institution
Maxim Integrated Products, Beaverton, OR, USA
Volume
3
fYear
2000
fDate
11-16 June 2000
Firstpage
1887
Abstract
Calibrated measurements are performed in a printed circuit board (PCB) environment using microstrip elements and ultra-small surface mount components as calibration standards. The calibration technique allows surface mount packages to be characterized from VHF to microwave frequencies. The use of microwave wafer probes for connection to the PCB is described.
Keywords
Calibration; Microstrip transitions; Microwave measurement; Printed circuit accessories; Printed circuit testing; Probes; Surface mount technology; CPW to microstrip transition model; PCB connection; VHF frequency; calibrated measurements; calibration standards; microstrip elements; microwave frequency characterization; microwave wafer probes; printed circuit board environment; surface mount packages; ultra-small surface mount components; wafer probes; Calibration; Coplanar waveguides; Integrated circuit modeling; Microstrip components; Microwave frequencies; Packaging; Printed circuits; Probes; Semiconductor device modeling; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location
Boston, MA, USA
ISSN
0149-645X
Print_ISBN
0-7803-5687-X
Type
conf
DOI
10.1109/MWSYM.2000.862350
Filename
862350
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