DocumentCode
2329029
Title
Modeling GaN power transistors
Author
Rudolph, Matthias
Author_Institution
Dept. of RF & Microwave Tech., Brandenburg Univ. of Technol., Cottbus, Germany
fYear
2010
fDate
12-13 April 2010
Firstpage
1
Lastpage
4
Abstract
Modeling GaN transistors is still a matter of research. The technology is still quite young and not yet fully mature. A second issue is the fact that GaN transistors are commonly used as packaged power devices. This paper discusses modeling results obtained for different GaN devices from a small HEMT to a 60-W packaged power transistor. It is shown that the performance state-of-the art GaN HEMTs are no longer strongly impacted by dispersion effects. Therefore, the well-known HEMT models can be successfully used for these transistors. Beginning with this finding, the model extraction for the 60-W packaged device is discussed step-by-step.
Keywords
III-V semiconductors; gallium compounds; power HEMT; semiconductor device models; semiconductor device packaging; wide band gap semiconductors; 60-W packaged power transistor; GaN; HEMT; MODFET; dispersion effects; power 60 W; power transistor modeling; semiconductor device packaging; Art; Gallium nitride; HEMTs; Microwave technology; Microwave theory and techniques; Microwave transistors; Power transistors; Radio frequency; Semiconductor device modeling; Semiconductor device packaging; MODFETs; power transistors; semiconductor device modeling; semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless and Microwave Technology Conference (WAMICON), 2010 IEEE 11th Annual
Conference_Location
Melbourne, FL
Print_ISBN
978-1-4244-6688-7
Type
conf
DOI
10.1109/WAMICON.2010.5461846
Filename
5461846
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