• DocumentCode
    2330700
  • Title

    Can nano-photonic silicon circuits become an INTRA-chip interconnect technology?

  • Author

    Yablonovitch, Eli

  • Author_Institution
    Univ. of California, Berkeley
  • fYear
    2007
  • fDate
    4-8 Nov. 2007
  • Firstpage
    309
  • Lastpage
    309
  • Abstract
    Surprisingly, nano-photonk silicon has already emerged as a commercial INTER-chip optical communications technology. This was made possible by Silicon-on-Insulator (SOI), technology, which integrates many of the optical communications components directly in silicon CMOS chips. Intel and Luxtera have both announced > 10Gb/sec optical modulators, integrated into silicon. All the other customarily required opto-electronic components; detectors, waveguides, splitters, couplers, filters, etc., are fully executed in CMOS designs, as well. Continuous wave optical power is provided from off-chip, just as dc power is currently provided from off-chip. The initial commercial applications are optical 10Gb/s Ethernet, Infiniband, and other INTER-chip, communications applications. The question to be addressed in this talk, is whether silicon nano-photonics can now make the final jump, to INTRA-chip optical interconnects?
  • Keywords
    CMOS integrated circuits; integrated optics; integrated optoelectronics; nanoelectronics; optical communication; silicon-on-insulator; INTER-chip optical communications; INTRA-chip interconnect technology; continuous wave optical power; nano-photonic silicon circuits; opto-electronic components; silicon CMOS chips; silicon-on-insulator; CMOS technology; Communications technology; Integrated circuit interconnections; Integrated circuit technology; Integrated optics; Optical fiber communication; Optical filters; Optical interconnections; Optical modulation; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2007. ICCAD 2007. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-1381-2
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2007.4397282
  • Filename
    4397282