Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Author

Higurashi, Eiji ; Sawada, Renshi ; Suga, Tadatomo

Author_Institution

Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan

fYear

2009

fDate

21-23 Sept. 2009

Firstpage

209

Lastpage

214

Abstract

This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150degC. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm times 2.8 mm times 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

Keywords

diffraction gratings; displacement measurement; fibre optic sensors; gold; light interferometers; microsensors; optical variables measurement; Au-Au; displacement measurement; grating interferometer; heterogeneous integration technology; optical displacement microsensor; size 1 mm; size 2.8 mm; temperature 150 C; Bonding; Displacement measurement; Gratings; Integrated optics; Microoptics; Microsensors; Optical devices; Optical interferometry; Optical refraction; Optical sensors; displacement measurement; grating interferometer; heterogeneous integration; low-temperature bonding; microsensor;

fLanguage

English

Publisher

ieee

Conference_Titel

Optomechatronic Technologies, 2009. ISOT 2009. International Symposium on

Conference_Location

Istanbul

Print_ISBN

978-1-4244-4209-6

Electronic_ISBN

978-1-4244-4210-2

Type

conf

DOI

10.1109/ISOT.2009.5326083

Filename

5326083