Signal integrity simulation design of image processor PCB combined with electromagnetic compatibility analyses based on Altium Designer 6

Author

Cheng, Y.Q. ; Zhu, M. ; Ge, W.

Author_Institution

Changchun Inst. of Opt., Fine Mech. & Phys., Chinese Acad. of Sci., Changchun

fYear

2009

fDate

25-27 May 2009

Firstpage

745

Lastpage

749

Abstract

With the coming of the high-speed digital system age, signal integrity (SI) and electromagnetic compatibility (EMC) should not be ignored any more. In this paper, based on basic theories of SI and EMC, the high-speed digital design method for PCB using the SI simulation tool of Altium Designer 6 and EMC analyses is introduced, and the impedance control, power integrity (PI) design and SI (reflections and crosstalk) design of a piece of image processor PCB are demonstrated in detail. The simulation results show that the impedance control is perfect, reasonable termination can improve the waveforms and control the reflections and crosstalk.

Keywords

circuit simulation; electromagnetic compatibility; microprocessor chips; printed circuit design; Altium designer 6; Signal integrity simulation design; electromagnetic compatibility analyses; high-speed digital design method; image processor PCB; impedance control; power integrity design; Analytical models; Electromagnetic analysis; Electromagnetic compatibility; Image analysis; Impedance; Process design; Reflection; Signal analysis; Signal design; Signal processing; Altium Designer 6; electromagnetic compatibility (EMC); high-speed digital design; signal integrity (SI); simulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics and Applications, 2009. ICIEA 2009. 4th IEEE Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-2799-4

Electronic_ISBN

978-1-4244-2800-7

Type

conf

DOI

10.1109/ICIEA.2009.5138304

Filename

5138304