DocumentCode
2336105
Title
Electrode protrusions and particle chaining as factors affecting the dielectric strength of air
Author
Dascalescu, L. ; Tobazéon, R.
Author_Institution
Inst. Univ. de Technol., Lab. Univ. de Technol. Electr. et Electron. Avancees, Angouleme, France
Volume
3
fYear
1998
fDate
12-15 Oct. 1998
Firstpage
1994
Abstract
Electrode protrusions and free particles have been demonstrated to reduce dramatically the breakdown voltage of insulating fluids. This paper examines two factors which affect the dielectric strength of gaseous insulators: (i) shape and size of electrode protrusions; and (ii) particle chain formation. A computer program, based on the boundary element method, was employed for the computation of the electric field modified by an electrode protrusion and/or a particle chain. The results regarding field enhancement were used as input data of another program that evaluated the dielectric strength of the air-gap. Two types of protrusions were studied: hemispheres and hemispherically-ended rods. One to ten conductive spheres were considered to be attracted to such protrusions and chain at the top of them. The computations showed that the large protrusions are more harmful than the small ones and that the dielectric strength of the air-gap decreases with the number of particles in a chain.
Keywords
air gaps; boundary-elements methods; electric fields; electric strength; electrical engineering computing; electrodes; air insulation; air-gap; boundary element method; breakdown voltage; computer program; conductive spheres; dielectric strength; electric field; electrode protrusion shape; electrode protrusion size; electrode protrusions; field enhancement; free particles; gaseous insulators; hemispheres; hemispherically-ended rods; input data; particle chain formation; particle chaining; Air gaps; Boundary element methods; Contamination; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Gas insulation; Shape; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location
St. Louis, MO, USA
ISSN
0197-2618
Print_ISBN
0-7803-4943-1
Type
conf
DOI
10.1109/IAS.1998.729883
Filename
729883
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