• DocumentCode
    2340608
  • Title

    Performance improvement of material recognition sensor using cubic spline interpolation

  • Author

    Cheol, Lim Young ; Kun, Park Jong ; Young, Cho Kyung ; Sun, Kim Eui ; Gon, Kim Tae ; Gon, Kim I.

  • Author_Institution
    Dept. of Electr. Eng., Chonnam Nat. Univ., Kwangju, South Korea
  • fYear
    1994
  • fDate
    10-12 May 1994
  • Firstpage
    328
  • Abstract
    This paper describes a noble robot sensor designed to recognize an unknown material by measuring thermal conductivity on various ambient temperature. An active sensor to measure the thermal conductivity of a gripped object was designed and the software program to discriminate material was developed with C language. To discriminate material, it is required to make the look-up table in which temperature response of different materials on the various ambient temperature are stored. But it is impractical to store data on the all ambient temperature. Therefore using cubic spline interpolation, we can estimate the temperature response on ambient temperature condition that is not stored in the look-up table
  • Keywords
    C language; computerised instrumentation; electric sensing devices; microcomputer applications; pattern recognition; robots; splines (mathematics); table lookup; temperature distribution; temperature measurement; thermistors; C language; active sensor; ambient temperature; cubic spline interpolation; gripped object; heat conduction; heat measurement; look-up table; material recognition sensor; noble robot sensor; software; temperature response; thermal conductivity; Conducting materials; Conductivity measurement; Robot sensing systems; Sensor phenomena and characterization; Software design; Software measurement; Table lookup; Temperature sensors; Thermal conductivity; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1994. IMTC/94. Conference Proceedings. 10th Anniversary. Advanced Technologies in I & M., 1994 IEEE
  • Conference_Location
    Hamamatsu
  • Print_ISBN
    0-7803-1880-3
  • Type

    conf

  • DOI
    10.1109/IMTC.1994.352057
  • Filename
    352057