DocumentCode
2342785
Title
Microchannel integrated heat sinks in silicon technology
Author
Perret, C. ; Schaeffer, Ch ; Boussey, J.
Author_Institution
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Volume
2
fYear
1998
fDate
12-15 Oct. 1998
Firstpage
1051
Abstract
The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. Thermal dissipation characteristics are calculated for several microchannels geometry. An optimised structure is proposed and its technological realisation is described.
Keywords
elemental semiconductors; heat sinks; power integrated circuits; silicon; substrates; Si; Si substrates; forced liquid cooling device; microchannel integrated heat sinks; microchannels geometry; optimised structure; power integrated circuits; silicon substrates; silicon technology; thermal dissipation characteristics; Cooling; Copper; Heat sinks; Heat transfer; Microchannel; Resistance heating; Silicon; Thermal conductivity; Thermal resistance; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location
St. Louis, MO, USA
ISSN
0197-2618
Print_ISBN
0-7803-4943-1
Type
conf
DOI
10.1109/IAS.1998.730276
Filename
730276
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